Tuesday, August 25, 2009

Step 2: Surface Preparation:




A clean surface is very important if you want a strong, low resistance joint. All surfaces to be soldered should be cleaned with steel wool and some sort of solvent. Laquer thinner works well. Some people like to use sand paper, but I think that it is all too easy to sand right through circuit board traces, so steel wool is my preference. Don't neglect to clean component leads, as they may have a built up of glue from packaging and rust from improper storage.

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